Instability and failure analysis of film-substrate structure under electrical loading

Wang, Qinghua,Xie, Huimin,Jia Liu,Feng, Xue,Fulong Dai

DOI: https://doi.org/10.1109/ICEPT.2009.5270578

2009-01-01

Abstract:Delamination between the film line and the substrate is a main influence factor for instability and failure of the film-substrate structure, which exists widely in the large scale integrated circuit. The Buckle-driven delamination of constantan film line on polymer substrate under electrical loading was investigated in this paper. The post-buckling theory for beam was introduced to quantitatively analyze the residual strain and the residual stress. The maximal tensile stress and the maximal compressive stress of the buckled film line was found to be 1.69 GPa and 2.03 GPa respectively, after bearing 3.14 times 108 A/m2 dc for 370.7 hours. The maximal compressive axial stress was 0.17 GPa, showing the bending stress contributes to the majority of the residual stress of the film line. The instability and the failure behavior of the film-substrate structure were studied.