Delamination and Electromigration of Film Lines on Polymer Substrate Under Electrical Loading

Qing-Hua Wang,Hui-Min Xie,Xue Feng,Zejing Chen,Fu-Long Dai
DOI: https://doi.org/10.1109/LED.2008.2008401
IF: 4.8157
2009-01-01
IEEE Electron Device Letters
Abstract:As the main influencing factors for instability of film lines are widely used in microelectromechanical systems, buckle-driven delamination and electromigration of film lines on polymer substrate under electrical loading are reported in this letter. The critical buckling condition is obtained through Euler formula. In addition, postbuckling analysis for the film is derived to calculate the residua...
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