Abstract:Flexible electronics has attracted much attention in recent years due to the favorable applications to many emerging devices. A novel laminated structure for a new-generation of flexible electronics is composed of several thin layers, where the hard functional components are built, glued by soft adhesives. To prevent the premature mechanical failure and to achieve the best performance of the electronics, the structural design of such a laminate is of crucial importance. Accordingly, it is necessary to establish an analytic model to accurately describe the mechanical behavior of the laminated structure. The available models fall into two categories: those only taking into account the normal strain-induced deformation of the soft adhesive layers and those only incorporating the shear deformation of the same layers. This paper aims to quantitatively figure out which deformation dominates. By establishing an accurate enough analytic model, a significant finding is revealed that shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics while the normal strain-induced deformation is negligible. The model is well validated by the finite element method (FEM). The effects of the membrane energy and bending energy of the soft layer are also investigated by incorporating or neglecting the shear energy. The model accurately captures the key quantities such as the strain distribution in each layer and the locations of the neutral mechanical planes of the top and bottom layers. This work is expected to provide the design guidelines for the laminated structure-based flexible electronics.

Interfacial Failure in Flexible Electronic Devices

Surface Effects on the Mechanical Behavior of Buckled Thin Film

Interfacial Slippage Of Inorganic Electronic Materials On Plastic Substrates

Interfacial Delamination of Inorganic Films on Viscoelastic Substrates

Transition among failure modes of the bending system with a stiff film on a soft substrate

Failure Mechanism of Underfill Fillet Cracks in Flexible Wearable Electronics

Failure mechanisms in flexible electronics

Slip zone model for interfacial failures of stiff film/soft substrate composite system in flexible electronics

Prediction and Regulation of Delamination at Flexible Film/Finite-Thickness-Substrate Structure Interfaces

Debonding Characterization of Stiff Film/compliant Substrate Systems Based on the Bilinear Cohesive Zone Model

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Experimental and Theoretical Analysis of Integrated Circuit (ic) Chips on Flexible Substrates Subjected to Bending

Shear Deformation Dominates in the Soft Adhesive Layers of the Laminated Structure of Flexible Electronics

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Slippage Toughness Measurement of Soft Interface Between Stiff Thin Films and Elastomeric Substrate

Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Study on the Crack Propagation of Stiff-Thin-Film-on-Soft-Substrate Structures under Biaxial Loading

Advancements in atomic-scale interface engineering for flexible electronics: Enhancing flexibility and durability

Dynamic Behaviors of Controllably Buckled Thin Films

Micro-Scale Delaminating and Buckling of Thin Film on Soft Substrate

Instability and failure analysis of film-substrate structure under electrical loading