Abstract:Flexible electronics has attracted much attention in recent years due to the favorable applications to many emerging devices. Composite structures, such as stacks consisting both hard and soft layers are widely adopted in the design of flexible electronics. Here, a series of related work are presented. 1) Flexible piezoelectric mechanical energy harvesters (MEHs), which are able to supply the pacemaker, are of recent interest as an important emerging variant of traditional piezoelectric devices. We propose the design of stacking multilayer MEHs with adhesive in between as an effective way to enhance the magnitude of power generation. An analytic model is established to study the mechanical behavior of the multilayer MEHs subjected to Euler buckling. Being different from the hypothesis of the plane section for the entire structure, it is found that each polyimide (PI) layer holds plane section of its own, while soft adhesives serve as shear lags. The deformation is almost the same for each PI layer, as well as PZT arrays, which is very beneficial to avoid the premature failure of devices. 2) We also present a rational analytic model to study the bending of a laminated structure on a cylinder, which is often regarded as an important approach to mechanical reliability testing of flexible electronics and photonics. 3) For this kind of laminated structure, we only take into account the shear deformation of the soft adhesive layers but some researchers only incorporate the normal strain-induced deformation of the same layers. By establishing an accurate enough analytic model, a significant finding is revealed that shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics while the normal strain-induced deformation is negligible. The model is well validated by the finite element method (FEM). The effects of the membrane energy and bending energy of the soft layer are also investigated by incorporating or neglecting the shear energy. The model accurately captures the key quantities such as the strain distribution in each layer and the locations of the neutral mechanical planes of the top and bottom layers. These works are expected to provide the design guidelines for the laminated structure-based flexible electronics.

Shear Deformation Dominates in the Soft Adhesive Layers of the Laminated Structure of Flexible Electronics

Structure Design And Analysis Of The Multilayer Stack Consisting Of Both Hard And Soft Layers For Flexible Electronics

Electromechanical Analysis and Simplified Modeling of Dielectric Elastomer Multilayer Bending Actuator

Splitting Of The Neutral Mechanical Plane Depends On The Length Of The Multi-Layer Structure Of Flexible Electronics

A simple analytical thermo-mechanical model for liquid crystal elastomer bilayer structures

Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Enhanced and Weakened Strength in Brittle Film-Substrate Structure

An analytical mechanics model for the island-bridge structure of stretchable electronics

A PIECEWISE LINEAR MODEL FOR ANALYZING THIN FILM/SUBSTRATE STRUCTURE IN FLEXIBLE ELECTRONICS

Prediction and Regulation of Delamination at Flexible Film/Finite-Thickness-Substrate Structure Interfaces

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Interfacial Failure in Flexible Electronic Devices

Interfacial Modeling of Flexible Multilayer Structures

A Model on the Curved Shapes of Unsymmetric Laminates Including Tool-Part Interaction

Flexoelectric and Surface Effects on Bending Deformation and Vibration of Piezoelectric Nanolaminates: Analytical Solutions

Adhesion-governed Buckling of Thin-Film Electronics on Soft Tissues

Folding stress analysis of a sandwich plate based on transversely isotropic and rate-dependent constitutive relationship of adhesive

Mechanically-compensated bending-strain measurement of multilayered paper-like electronics via surface-mounted sensor

Large deformation modeling of flexible piezoelectric materials

Buckling behaviour of a stiff thin film on a finite-thickness bi-layer substrate