Abstract:Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.

Interfacial Delamination of Inorganic Films on Viscoelastic Substrates

Interfacial Failure in Flexible Electronic Devices

Interfacial Slippage Of Inorganic Electronic Materials On Plastic Substrates

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Prediction and Regulation of Delamination at Flexible Film/Finite-Thickness-Substrate Structure Interfaces

Interfacial Modeling of Flexible Multilayer Structures

Topography-driven Delamination of Thin Patch Adhered to Wrinkling Surface

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Debonding Characterization of Stiff Film/compliant Substrate Systems Based on the Bilinear Cohesive Zone Model

Surface effects on the wrinkles in a stiff thin film bonded to a compliant substrate

A Novel Thermal-Mechanical Model and the Characteristics of Interfacial Stress in the Laminated Structure for Flexible Electronics

Dynamic Wrinkling Instability of Elastic Films on Viscoelastic Substrates

Competing Behavior of Interface Delamination and Wafer Cracking During Peeling Film from Ultra-Thin Wafer

Interfacial fatigue fracture of elastomer bilayers under cyclic large deformation

Effects of Interfacial Properties on the Ductility of Polymer-Supported Metal Films for Flexible Electronics

Exploiting Interfacial Instability During Peeling a Flexible Plate from Elastic Films

Rate Dependent Interface Delamination in Plastic IC Packages

Interfacial Behavior of Thin Film Bonded to Plastically Graded Substrate under Tensile Loading

Peridynamic Fracture Analysis of Film–substrate Systems

The interfacial behavior of a liquid crystal elastomer film bonded to an orthotropic substrate under light illumination

A Novel Thermomechanical Model for Predicting Interfacial Stresses in Flexible Hybrid Laminate