Buckling Behavior Of Metal Film/Substrate Structure Under Pure Bending

Ying Li,Xishu Wang,Xiangkang Meng
DOI: https://doi.org/10.1063/1.2897035
IF: 4
2008-01-01
Applied Physics Letters
Abstract:Many studies on the thin film/substrate structure and its failure mechanism were reported in recent years. The direct experimental results of thin film/substrate structure by scanning electron microscopy presents an intriguing problem: there exists a buckling failure mechanism at the lateral edge of metal film under pure bending. The qualitative theoretical analysis has been done on such buckling failure of thin film/substrate structure. The experimental results and theoretical analysis are helpful to understand the extrinsic stresses or deformations that are induced by external physical effects. (C) 2008 American Institute of Physics.
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