Abstract:Cracks at the soldering area during electromigration (EM) and isothermal ageing in solder joints has become a critical reliability issue with the development of electronic industry. Addressing to the fracture along the interface between Cu and Cu 3 Sn, This paper studied its interface strength under mode-I and mode-II loading condition with the strain rate of 0.0027 ps -1 via molecular dynamics (MD) simulation. MEAM (modified embedded atom method) was used for modeling the interaction between Cu-Sn atoms, and simulation box size of 55 Å × 47.7 Å × 69.12 Å was used for investigation the properties of the model interface. Especially, this paper focus on the effect of orientation of Cu on the interface strength of Cu 3 Sn-Cu interface structure. CSP (centro-symmetry parameter) was also analyzed for the better understanding of its dissipative mechanism. From the MD result, orientation of Cu has great influence on the Cu 3 Sn-Cu interface strength under mode-I deforming, and Cu 3 Sn-(001)Cu interface structure has a higher interface strength compared with others, while it have little effect under mode-II deforming condition.

SEM In Situ Study on Deformation Behavior of Cu and Cu/Ni Films under Three-Point Bending

SEM In-Situ Investigation on Failure of Nanometallic Film/substrate Structures under Three-Point Bending Loading

SEM in-situ investigation on micro failure characterizations of multi Cu/Ni films under bending loading

Research on Deforming Mechanism of Nanocrystalline Cu Thin Film under Contact Deformation

Role of Interfacial Transition Zones in the Fracture of Cu/V Nanolamellar Multilayers

Deformation-induced Interfacial Transition Zone in Cu/V Nanolamellar Multilayers

Buckling Behavior Of Metal Film/Substrate Structure Under Pure Bending

An Estimation Method on Failure Stress of Micro Thickness Cu Film-Substrate Structure

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

The Effect of Cu Orientation on Fracture Location in Cu<inf>3</inf>Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation

Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact

In Situ Nanoindentation Mechanical Property of Films by Atomic Force Microscope

In situ nanomechanical measurement of Cu nanowires

Micro 3D Measurement Applied to Interfacial Deformation of Bilayer Thin Film/substrate Structure under Thermal Cycling Loads

Strain Rate Sensitive Stretchability and Fracture Behavior of Nanocrystalline Cu Films on Flexible Substrate

In-situ observation of transition between surface relief and wrinkling in thin film shape memory alloys.

In Situ Synchrotron X-ray Diffraction Analysis of Deformation Behaviour in Ti-Ni-based Thin Films.

Tensile deformation and fracture mechanisms of Cu/Nb nanolaminates studied by in situ TEM mechanical tests

Investigations of Micro-Deformation in Monocrystalline Copper at Low Temperatures via Indentation

Microstructure evolution and anti-wear mechanism of Cu film fabricated by magnetron sputtering deposition

Instability and failure analysis of film-substrate structure under electrical loading