Abstract:An in situ nanoindentation test system was established by combining atomic force microscope (AFM) and scan electron microscope (SEM). This system enabled the indentation experiment using the AFM cantilever with Cube corner diamond indenter, and acquired the curve of load versus displacement. The experimental process can be observed in real time by in situ SEM simultaneously. A mechanical property testing method, based on the AFM cantilever loading curve and the in situ SEM indentation of images analysis, was well developed. The hardness and elastic model of the plastic thin film were obtained by measuring the maximum loading during the indentation and the residual area of the indentation by measuring SEM image. This method was demonstrated by conducting the indentation experiment on the sliver film deposited on the Si substrate using magnetron sputtering. Furthermore, the experiment conducted by the Nanoindenter G200 was presented here for comparison. The results show that the in situ AFM indentation possesses higher resolution of loading and displacement, and can achieve the indentation experiment scaled from nN to mN of the applied load. The hardness of the plastic thin film can be obtained by measuring the residual area of indentation. The pile-up effect of the soft film deposited on the hard substrate, which exists in the Oliver-pharr method, can be reduced by SEM image analyses of residual area and the calculation has a higher testing accuracy and reliability as well.

SEM In-Situ Investigation on Failure of Nanometallic Film/substrate Structures under Three-Point Bending Loading

SEM In Situ Study on Deformation Behavior of Cu and Cu/Ni Films under Three-Point Bending

SEM in-situ investigation on micro failure characterizations of multi Cu/Ni films under bending loading

Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Micromechanical simulation of fracture behavior of bimodal nanostructured metals

Role of Interfacial Transition Zones in the Fracture of Cu/V Nanolamellar Multilayers

Research on Deforming Mechanism of Nanocrystalline Cu Thin Film under Contact Deformation

In situ nanomechanical measurement of Cu nanowires

Strain Rate Sensitive Stretchability and Fracture Behavior of Nanocrystalline Cu Films on Flexible Substrate

In situ observation of intergranular fracture propagation in nanocrystalline freestanding ultrathin tungsten film

In Situ Nanoindentation Mechanical Property of Films by Atomic Force Microscope

Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact

Micro/nanoscale mechanical characterization and in situ observation of cracking of laminated Si3N4/BN composites

In Situ Synchrotron X-ray Diffraction Analysis of Deformation Behaviour in Ti-Ni-based Thin Films.

Tensile deformation and fracture mechanisms of Cu/Nb nanolaminates studied by in situ TEM mechanical tests

Buckling Behavior Of Metal Film/Substrate Structure Under Pure Bending

SEM In-Situ Study on the Effect of Offset-Notch on Basalt Cracking Behavior under Three-Point Bending Load

An Estimation Method on Failure Stress of Micro Thickness Cu Film-Substrate Structure

Study on the Crack Propagation of Stiff-Thin-Film-on-Soft-Substrate Structures under Biaxial Loading

DIC/EBSD Coupling Analysis of Microstructure Evolution and Strain Localization During Bending of Al-Li Alloy

Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test