DIC/EBSD Coupling Analysis of Microstructure Evolution and Strain Localization During Bending of Al-Li Alloy

Jin Xiao,Zhang Guodong,Xue Fei,Zhao Yanfen,Liu Wenbo
2019-01-01
Rare Metal Materials and Engineering
Abstract:The damage mechanism of commercial 2060 (T8) aluminum alloy during bending was studied. The microstructure evolution and strain localization were investigated by scanning electron microscope (SEM), electron backscattered diffraction (EBSD) and digital image correlation (DIC) methods. A new method based on the dispersion distribution of copper powders was developed, which can be used to simultaneously characterize the strain distribution and microstructure evolution of the same region. The experimental results show that the macro shear band is formed during the bending, and the crack grows along the macro shear band. This phenomenon can be attributed to the larger volume fraction of small angle grain boundaries (SAGBs) formed in the macro shear band, and less energy is needed if the crack propagates in the direction of macro shear bands.
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