Prediction of Fracture Toughness of Thin Films by Quasi-continuum Method

赵晟,江五贵,程莹
DOI: https://doi.org/10.3969/j.issn.1673-6214.2008.04.004
2008-01-01
Abstract:Using the two-dimensional(2D)quasicontinuum method(QC),the plastic deformation of a single crystal aluminum film by a rigid triangular indenter in the nanoindentation test was simulated to study the mechanical properties of the aluminum thin film.Nanohardness,elastic modulus as well as fracture toughness were calculated from the load-displacement curves obtained by QC.The calculation results show that the calculated value of the fracture toughness of the single crystal aluminum(KIC)is 0.216MPa·m1/2,consistent with the experiment results,which indicates that the presented approach is feasible for predicting KIC of thin film materials.The deformation concentration zone in the displacement contour is corresponding to the quick decline zone of the load-displacement curve,which indicates that the radial crack occurs at the deformation concentration zone.The calculation results prove that the radial cracks of thin films can be effectively calculated by combination of the load-displacement curve and the displacement contour.
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