Abstract:A Cu-Ti alloy is widely used in various applications, such as battery terminals and antenna terminals, due to its superior strength, elevated elasticity, and excellent environmental protection. However, a new microstructure of Cu-Ti alloy with ultrahigh conductivity, strength, and elasticity needs to be investigated. To achieve this, a method of graded two-step deformation and heat aging is employed to create a novel microstructure of a nano-twin structure with a spacing of 3.2 nm and a precipitated phase with a spacing of 75-110 nm. The nano-twin structure contributes to the extreme strength and conductivity of the alloy. Specifically, the Cu-2Ti alloy exhibits a super high electrical conductivity of 25.23 ± 0.09 % IACS. This is attributed to the controlled spacing of the precipitated phase of Cu4Ti, which is maintained at 75-110 nm, and the high carrier mobility of 66813 cm 2 /(V*s). In terms of strength, the Cu-2Ti alloy demonstrates great tensile strength of 1022 ± 87.49 MPa and hardness of 356.24 ± 29.70 MPa. The strength of the alloy can be further enhanced by precipitating Cu4Ti at nanoscale spacing, resulting in the highest average geometric dislocation density of 8.05 × 10 14 /m 2 and the lowest angular grain boundaries of 91.2 %. Additionally, the Cu-2Ti alloy exhibits high elasticity, with an elastic specific work that is 3.7 times higher than that of the conventional elastic alloy Cu-2Be. This is achieved through graded deformation and aging, along with the addition of 2 wt.% Ti. Overall, the two-stage cold rolling and aging method provides a novel microstructure to solve the problem that the strength and conductivity of Cu-Ti alloys are reciprocal, enabling the development of alloys with exceptional properties.

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