Nanocompound-induced Anti-Softening Mechanisms: Application to CuCr Alloys

Huiya Yang,Yeqiang Bu,Jinming Wu,Youtong Fang,Jiabin Liu,Hongtao Wang
DOI: https://doi.org/10.1016/j.msea.2022.143038
IF: 6.044
2022-01-01
Materials Science and Engineering A
Abstract:A nanocompound-induced anti-softening mechanism is proposed for preparing high strength and high conductivity CuCr alloys with favorable softening resistance. The mechanism is to introduce nanocompound at the Cu/Cr interface to suppress the coarsening of Cr precipitate. To verify the mechanism, Co and Ti are added to the CuCr alloy. CoTi compounds precipitate around the Cr precipitates after aging treatment. The coarsening of Cr and CoTi phases are both suppressed thanks to the low diffusion rates of Co and Ti atoms in Cu. Additionally, Cr and CoTi precipitates also inhibit the recrystallization. As a result, the CuCrCoTi alloy displays a higher softening temperature (> 600 & nbsp;) than CuCr alloys.
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