Abstract:A site-specific xenon plasma focused ion beam preparation technique for microcantilever samples (1-20 µm width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift-out onto a clean silicon wafer to facilitate easy access of a low-cost probe type indenter which provides bending force measurement. The lift-out method allows sufficient room for the indenter and a line of sight for the electron beam to enable displacement measurement. An electroplated nanotwinned copper (NTC) was cut to a 3 × 3 × 25 µm microbeam and in situ mechanically tested using the developed technique. It demonstrated measured values of Youngs modulus of 78.7 ± 11 GPa and flow stress of 0.80 ± 0.05 GPa, which is within the ranges reported in the literature. LAY DESCRIPTION: In this paper a site specific method is present for making particularly small mechanical tests samples, of the order of 100th the size of a human hair. These small samples can then be used to determine the mechanical properties of the bulk material. Copper with a nano twinned grain structure is used as a test medium. Ion milling was used to cut the sample to shape and a micro probe was used for mechanical testing. Ion milling can cut away very small volumes of material as it accelerates ions at the surface of the sample, atomically machining the sample. Micro probes are a cost-effective small-scale load measurement devices, however, they require a large area for accessing the sample. The indenter requirements are a problem when making you samples with ion milling as ion millers are best at making small cuts. Our aim was to design a cutting strategy which reduces the amount of cutting required while allowing samples to be fabricated anywhere on the sample. We used a chunk lift out technique to remove a piece of material which is then welded to a wafer of silicon this gives sufficient space around the sample for ion milling and testing. The additional space allowed easy access for the probe. A 3 × 3 × 10 µm micro cantilever beam was cut out from copper, this beam was then bent. The force from bending and distance bent was measured and converted into Youngs modulus which is a measure of flexibility. The modulus value measured was comparable to the values reported in other papers.

On‐chip Test Method for In‐situ Evaluating the Impact Resistance Reliability of Silicon Microbeams

Dimension effect on mechanical behavior of silicon micro-cantilever beams

A Novel Impact Tester for in Situ Evaluating the Shock Reliability of Micro-Structures

On-Chip Generation Method of Shock Load and Characterization of Microstructure Shock Process

A New Test Structure To Measure Bonding Strength In Micro-Bonding Area

Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

Study and Measurement of Micro-Scale Bonding Strength in Vertical Direction

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Technique and Structure for Testing Bonding Intension in Micron Scale

Investigation of stress rupture properties of micro beams using the piezoresistive effect

A Universal Structure for Self-Aligned in Situ On-Chip Micro Tensile Fracture Strength Test

On-chip testing method for measurements of friction and wear in moveable MEMS devices

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams

An In-Situ Tester for Extracting Piezoresistive Coefficients.

An On-Chip Bistable Structure for Extracting the Impact Fracture Strength of the Microstructure

A Dual-Parameter On-Chip Test Platform Based on Thermal Actuator for Testing Fracture Strength of Microstructure

NEW METHOD FOR MEASUREMENT OF DEFORMABILITY OF RBCs USING MICROCHANNELS FORMED IN A SILICON SUBSTRATE

APPLICATION OF SUPER-MICRO TESTER IN MEMS BONDING STRENGTH TEST