Effect of Superlattice on The Thermal Resistance of Aluminum and Silicon Interface

Yi ZANG,Deng-Ke MA,Nuo YANG
2017-01-01
Journal of Engineering Thermophysics
Abstract:In recent years,improving the micro/nano electronic devices heat dissipation and the thermal transport properties of the material interfaces has become a widespread concern.The important reason is that the thermal interface resistance results in the micro/nano electronic devices heating,which restricts the devices' performance.So we propose a method to decrease the thermal interface resistance by using superlattice structure.In this paper,the thermal interface resistance between Al and SisL was simulated by a non-equilibrium molecular dynamics method.Our results show that using SiSL can decrease the thermal interface resistance obviously.And we also give some theory analysis,it is better for us to understand the mechanism of the interfacial heat transfer.
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