Design and Experiments of Microplasma Reactor for Scanning Plasma Etching

WANG Hai,WEN Li,CHU Jia-ru
DOI: https://doi.org/10.3969/j.issn.1672-6030.2005.03.012
2005-01-01
Nanotechnology and Precision Engineering
Abstract:A new type of scanning plasma etching based on parallel probe actuation is introduced. The key device of scanning plasma etching——microplasma device is designed and fabricated. The I-V curve of the device was measured, and the relations between electrical characteristics and gas pressure or device dimension are discussed. The result shows that stable microplasma can be generated, when the gas is 100% SF6, gas pressure range from 2000-6 000 Pa, breakdown voltage between 390-445 V, power density between 10-150 W/ cm2 , which could satisfy the requirement of future scanning plasma etching applications.
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