Technological study on laser cutting of polycrystalline diamond compact

Qiang GUO,Zhi-xin JIA,Jian-qiang GAO,Jin-gang HUANG,Wen-biao LIU,Wan-long QUAN
DOI: https://doi.org/10.3969/j.issn.1001-5078.2017.06.007
2017-01-01
Abstract:Polycrystalline diamond (PCD) compact is widely used in cutting tool industry because of its high hardness,good wear resistance and other characteristics.In order to explore the PCD compact laser cutting technology characteristics,obtain the optimal cutting quality and processing efficiency,reduce the grinding allowance,cutting experiments of 1.6 mm thick PCD compact with Nd∶YAG laser were carried out.The cutting surface and cross-section of the material were observed and analyzed by using digital microscope and optical profiler.The effects of laser power,cutting speed,pulse repetition rate and defocusing amount on cutting quality were systematically studied.The process parameters were analyzed and optimized by the visual analysis and variance analysis of orthogonal experiments.The effect mechanism of laser energy on materials under different parameters was also explored.The experiment results show that the surface energy density of the material determines the quality of laser cutting.Finally,the good quality of laser cutting of PCD compact with 173.10 μm slit width,5.90° unilateral slit taper and 0.65 μm surface roughness can be obtained under the condition of laser power 80 W,cutting speed 80 mm/min,pulse repetition rate 60 Hz and zero defocus amount.
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