Study of non-brittle removal mechanism in grinding of polycrystalline diamond compact

Qian-zhong JIA,Man LI,Hong-tao ZHANG,Hai DONG,Fu-zheng QU
DOI: https://doi.org/10.7511/dllgxb201503008
2015-01-01
Abstract:Grinding of polycrystalline diamond (PCD ) is an important process in PCD cutter manufacturing . The grinding parameters can strongly influence the removal form of PCD , and determine the performance of the cutting tool . Non-brittle removal mechanism of PCD including scoring effect ,sliding effect and thermochemical reaction ,as well as their relations with grinding parameters ,are investigated by examining the surface micro-morphology of pre-etched PCD specimens using scanning electron microscopy .The experimental results indicate that scoring effect ,which is functional in the initial stage of wet grinding ,happens only when the wear particles of diamond wheel are sharp .On the contrary ,sliding effect and thermochemical reaction ,which happen simultaneously , are the main removal mechanisms when wear particles of diamond wheel are blunt .At last ,a special group of grinding experiments are carried out and the existence of a softened layer caused by thermochemical reaction on the ground surface of PCD is confirmed indirectly .
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