Polishing of polycrystalline diamond by the technique of dynamic friction. Part 2: Material removal mechanism

Y. Chen,L.C. Zhang,J.A. Arsecularatne
DOI: https://doi.org/10.1016/j.ijmachtools.2006.11.003
IF: 10.331
2007-01-01
International Journal of Machine Tools and Manufacture
Abstract:This paper investigates the material removal mechanisms of PCD using the dynamic friction polishing technique. Scanning electron microscopy, energy dispersive X-ray, X-ray diffraction and Raman spectroscopy were used to identify the mechanisms by analyzing the specimen surfaces and debris produced by polishing. It was found that the material removal occurred in a rather complex way, which can be a chemo-mechanical process, diffusion, oxidization and evaporation, or their combinations.
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