Selective Wet Etching of AlGaAs in HF/CrO3 Solutions: Application to Vertical Taper Structures in Integrated Optoelectronic Devices
Hui Huang,Yongqing Huang,Xiaomin Ren
DOI: https://doi.org/10.1116/1.1481861
2002-01-01
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena
Abstract:The etch rate and surface morphology of AlxGa1−xAs (x=0.3, 0.5, 0.65) versus composition of CrO3/HF solutions were studied using the dynamic etch mask technique. The selectivity, defined as a ratio of the etch rates, decreases from 179 to 8.6 for Al0.8Ga0.2As/Al0.3Ga0.7As with the volume ratio of HF (48 wt %)/CrO3(33 wt %) increasing from 0.01 to 0.138. The selective etching was experimentally applied to the fabrication of the vertical taper structures with angles ranging from 0.32° to 6.61° on an Al0.3Ga0.7As epitaxial layer. The surface roughness of AlxGa1−xAs (x=0.3, 0.5, 0.65), which was etched by CrO3/HF at a volume ratio of 0.028, were 1.8, 9.1, and 19.3 nm, respectively. The dependence of etch rate for AlxGa1−xAs (x=0.8, 0.85, 0.9) on composition of CrO3/HF has also been obtained. This technique has proven to be very useful in integrated optoelectronic device fabrication.