Dielectric Loss Tangent Extraction Using Modal Measurements and 2-D Cross-Sectional Analysis for Multilayer PCBs
Shaohui Yong,Victor Khilkevich,Yuanzhuo Liu,Han Gao,Scott Hinaga,Soumya De,Darja Padilla,Douglas Yanagawa,James Drewniak
DOI: https://doi.org/10.1109/temc.2019.2949021
IF: 2.036
2020-08-01
IEEE Transactions on Electromagnetic Compatibility
Abstract:Frequency-dependent electrical properties of dielectric materials are one of the most important factors for high-speed signal integrity design. To accurately characterize material's dielectric loss tangent (tan) after multilayer printed circuit board fabrication a novel method was proposed recently to extract tan using coupled striplines measured S-parameters and cross-section geometry. By relating modal attenuation factors to the ratio between the differential and common mode per-unit-length resistances, the surface roughness contribution is eliminated and the contributions of dielectric and conductor loss are separated. Here, we specifically decided to avoid using any physical dielectric model in the extraction algorithm in order to eliminate a need for any a priori information about dielectric behavior. Further analysis and improvement of the tan extraction approach is presented in this article. To evaluate the accuracy of the extraction, the impact of errors due to de-embedding, vector network analyzer measurement, and two-dimensional solver's calculation are taken into account by a statistical error model. A confidence interval of extracted tan is provided. To describe the frequency dependence of tan, a two-term Djordjevic model is proposed to fit the extracted tan curve, which guarantees causality and gives better agreement with measured insertion loss compared to the traditional Djordjevic model.
telecommunications,engineering, electrical & electronic