An Improved Thru-Line De-Embedding Technique up to 80 GHz
Shirong Lv,Fusheng Tang,Mingqi Jiao,Shengli Zhang,Liang Xie
DOI: https://doi.org/10.1109/mim.2022.9908272
2022-10-05
IEEE Instrumentation and Measurement Magazine
Abstract:With the rapid increase of high-speed communications, the frequency range of integrated circuits enters the field of millimeter wave, and the size of devices has become smaller and smaller. In the measurement of microwave devices, the probe cannot contact the device directly. The actual device under test (DUT) is surrounded by metal traces called leads, which provide the interface between the probing pads on the wafer and the DUT itself. The probes are pressed on the pads at both ends of the DUT. The parasitic effect of pads and transmission lines is significant at high frequency. The established technique such as Short-Open-Load-Thru (SOLT) and Line-Reflect-Reflect-Match (LRRM) move the reference plane up to the tip of the probes by means of Cascade Microtech impedance standard substrate (ISS). To obtain accurate parameters of DUT, a deembedding method must be implemented to eliminate the influence of pads and interconnect transmission lines.
engineering, electrical & electronic,instruments & instrumentation