Abstract:Micro electroforming is an important technology, which is widely used for fabricating micro metal devices in MEMS. The micro metal devices have the problem of poor adhesion strength, which has dramatically influenced the dimensional accuracy of the devices and seriously limited the development of the micro electroforming technology. In order to improve the adhesion strength, ultrasonic agitation method is applied during the micro electroforming process in this paper. To explore the effect of the ultrasonic agitation, micro electroforming experiments were carried out under ultrasonic and ultrasonic-free conditions. The effects of the ultrasonic agitation on the micro electroforming process were investigated by polarization and alternating current (a.c.) impedance methods. The real surface area of the electroforming layer was measured by cyclic voltammetry method. The compressive stress and the crystallite size of the electroforming layer were measured by X-ray Diffraction (XRD) method. The adhesion strength of the electroforming layer was measured by scratch test. The experimental results show that the imposition of the ultrasonic agitation decreases the polarization overpotential and increases the charge transfer process at the electrode-electrolyte interface during the electroforming process. The ultrasonic agitation increases the crystallite size and the real surface area, and reduces the compressive stress. Then the adhesion strength is improved about 47% by the ultrasonic agitation in average. In addition, mechanisms of the ultrasonic agitation improving the adhesion strength are originally explored in this paper. The mechanisms are that the ultrasonic agitation increases the crystallite size, which reduces the compressive stress. The lower the compressive stress is, the larger the adhesion strength is. Furthermore, the ultrasonic agitation increases the real surface area, enhances the mechanical interlocking strength and consequently increases the adhesion strength. This work contributes to fabricating the electroforming layer with large adhesion strength.

Evaluation Of Residual Stress Of Metal Micro Structure Electroformed With Megasonic Agitation

Research On High-Frequency Vibratory Stress Relief For Small Assembly

Reducing the residual stress in micro electroforming layer by megasonic agitation

Experimental Study of High-Frequency Vibration Assisted Micro/Mesoscale Forming of Metallic Materials

Effectiveness Of Stress Release Geometries On Reducing Residual Stress In Electroforming Metal Microstructure

Effects of superimposed high-frequency vibration on deformation of aluminum in micro/meso-scale upsetting

Micro Pin Extrusion of Metallic Materials Assisted by Ultrasonic Vibration

Study on Internal Stress in Micro-Electroformed Layer

Residual stress measurement in a metal microdevice by micro Raman spectroscopy

Effects of Ultrasonic Agitation on Adhesion Strength of Micro Electroforming Ni Layer on Cu Substrate

Experimental Study on the Relationship Between Dislocation Density and Internal Stress in Micro Electroforming Layer

Residual Stress Modeling and Analysis for Micro Electroforming Layer

Enhancement mechanism of megasonic field on bubble removal in nickel micro electroforming

Improving the Thickness Uniformity of Micro Electroforming Layer by Megasonic Agitation and the Application

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Stress-Etching Using Laser Electrochemical Micromachining with Masks

A Novel Residual Stress Test Structure for MEMs Thin Films

Study of liquid-phase mass transfer and residual stress in jet electrodeposition process with coaxial megasonic agitation

Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field

Microstructure and Residual Stress Gradient Evolution Mechanism of Electronic Copper Strip for Lead Frame

Optimization of residual stresses generated by ultrasonic nanocrystalline surface modification through analytical modeling and data-driven prediction