Abstract:The mechanical strengths of silicon wafers are crucial for the manufacturing yield of integrated circuits (ICs), which have received intensive attention over the years. With reducing the feature size of ICs, the mechanical strengths of silicon wafers become more significant. Actually, the gliding of indentation dislocations on single-crystalline silicon wafers at a given temperature reflects the mechanical strengths of silicon wafers. Since the gliding of indentation dislocations is driven by the residual stress around the indentation, the investigation on the correlation between the residual stress and dislocation gliding is of significance. In this paper, we first use micro-Raman microscopy to characterize the relief of stress around the indentation due to the annealling at 300 or 500 ℃. Then the effect of such a relief-stress on the gliding of indentation dislocations at 700-900 ℃ is investigated. In the case without the prior stress-relief, the indentation dislocations glide to the maximum distance after 2 h annealling at 700-900 ℃. With the prior stress-relief due to the annealling at 300 or 500 ℃, the indentation dislocations can still glide to the maximum distance after 2 h annealling at 900 ℃, however the gliding velocity significantly decreases and the gliding distance is remarkably reduced after 2 h annealling at 700 or 800 ℃. Such a reduction of gliding distance is most significant in the case of 700 ℃ annealling following the stress-relief with the 500 ℃/2 h annealling. Despite the prior stress-relief, as long as the annealing time at 700 or 800 ℃ is sufficiently extended, the indentation dislocations can glide to the maximum distance. In view of the above results, it is believed that the maximum gliding distance of indentation dislocations at a given temperature is independent of the values of residual stress around the indentation provided that the residual stresses are larger than the critical stress for driving the dislocation movement. Nevertheless, the annealing time for achieving the maximum gliding distance at a given temperature should be remarkably extended as the residual stresses around the indentation are relieved.

Research On High-Frequency Vibratory Stress Relief For Small Assembly

Research on High-Frequency Vibratory Stress Relief of Small Cr12mov Quenched Specimens

Mechanism and Experimental Research on High Frequency Vibratory Stress Relief

Vibration Stress Relief Mechanism and Its Impact on Fatigue Life

Research and Development of Vibratory Stress Relief

Experimental Study of High-Frequency Vibration Assisted Micro/Meso-Scale Forming of Metallic Materials

Effects of superimposed high-frequency vibration on deformation of aluminum in micro/meso-scale upsetting

Acoustic Softening and Residual Hardening in Aluminum: Modeling and Experiments

The combined magnetic-vibration stress relief

Effect of Induction Heat Treatment on Residual Stress Distribution of Components Fabricated by Wire Arc Additive Manufacturing

Microscopic Mechanism of the Combined Magnetic-Vibration Treatment for Residual Stress Reduction

Evaluation of residual stress relief of aluminum alloy 7050 by using crack compliance method

Investigating the Effects and Mechanisms of Thermal–Vibration-Coupled Stress Relief Treatment on Residual Stress in SiC/Al Composites

Effect of Prior Stress-Relief on the Gliding of Indentation Dislocations on Silicon Wafers

Micromechanism of Residual Stress Reduction by Low Frequency Alternating Magnetic Field Treatment

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Reducing the residual stress in micro electroforming layer by megasonic agitation

Research On Magnetic-Vibration Combination Treatment Based On Multifield Coupled Finite Element Analysis

A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure

Regulation of residual stress in elastic solid component with high-energy acoustic field

Finite Element Simulation Analysis on Residual Stress Relief of 7075 Aluminum Alloy Ring