The Contact Behavior Analysis Between Microcomponents on a Low-Frequency Reciprocating-Fretting Ball-on-Flat Tribometer

Zhongnan Wang,Wuyi Wang,Guangyu Zhang,Hejuan Chen
DOI: https://doi.org/10.1007/978-3-662-48768-6_14
2016-01-01
Abstract:Fatigue failure between the reciprocating sliding microcomponents is the key factor that affects the performance and reliability of microelectromechanical system (MEMS) under alternative load. Sliding friction pairs on the smooth surface are at very slow scan rates and friction-induced vibration is caused by stick-slip phenomenon that is generated from nanometer clearance between the friction pairs. In this paper, a developed tribometer is applied to simulate the fretting friction with low-frequency reciprocation. Dynamic friction coefficient is measured with the normal load of 0-60 mN from a series of tribological tests of a small steel ball sliding on various flat surfaces such as PTFE, silicon wafer, and glass in a straight-line, oscillating motion configuration. The contact stress, contact force, and surface deformation with or without friction in these three configurations are calculated by the variation of friction coefficient according to the Hertz contact theory. Experimental results show that the friction force is not nearly dependent of the normal load and contact deformation is at nanoscale sizes in steel ball-on-silicon wafer configuration. Friction coefficient measured by the developed tribometer is combined with the contact stress calculation for the structural design of microcomponents before manufacturing MEMS devices.
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