Performance Enhancement of Metal Floating Gate Memory by Using A Bandgap Engineered High-K Tunneling Barrier

Dandan Jiang,Lei Jin,Zhiliang Xia,Guoxing Chen,Xingqi Zou,Yu Zhang,Zhaoyun Tang,Zongliang Huo
DOI: https://doi.org/10.1149/07202.0051ecst
2016-01-01
Abstract:Metal floating gate (FG) memory has been a promising candidate to continue the scaling of NAND flash technology node beyond 1X nm. In this work, metal FG memory device with high-k engineered tunneling layer has been demonstrated. Compared to a single SiO2 tunneling layer, a metal FG memory device based on the OH/OHA tunneling layer exhibits a larger memory window, low operation voltage, faster program/erase speed, and improved data retention. Enhancements of memory performance and reliability are attributed to the high defect state density at the interface of OH/OHA and large physical thickness of tunneling layer by bandgap engineering. The findings provide a guide for future design of metal FG memory.
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