Metal Floating Gate Memory Device with SiO 2 /hfo 2 Dual-Layer As Engineered Tunneling Barrier

Guoxing Chen,Zongliang Huo,Lei Jin,Yulong Han,Xinkai Li,Su Liu,Ming Liu
DOI: https://doi.org/10.1109/led.2014.2320971
IF: 4.8157
2014-01-01
IEEE Electron Device Letters
Abstract:Metal as floating gate (FG) in combination with high-k dielectrics has been seen as a possible solution to continue the scaling of NAND flash technology node beyond 2x nm. In this letter, it is demonstrated that stacked metal FG memory cell with SiO2/HfO2 dual-layer engineered tunneling barrier shows good memory characteristics. It presents favorable performance with lower operation voltage as well as enhanced program/erase speed. Furthermore, improvement of data retention is also obtained, proving that SiO2/HfO2 engineered tunnel barrier is promising for the improvement of metal FG memory performance.
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