Etch-Pits, of Gan Films with Different Etching Methods

M Lu,HZ Fang,ZJ Yang,H Yang,ZL Li,R Qian,GY Zhang,Z Bei,X Chang
DOI: https://doi.org/10.3969/j.issn.1674-4926.2004.11.006
2004-01-01
Journal of the Korean Physical Society
Abstract:High quality GaN films on (0001) sapphire substrates were grown by a commercial MOCVD system (Thomas Swan Corp.). We have studied the etch-pits and threading dislocations in GaN films by wet etching methods such as mixed acid solution (H3PO4 : H2SO4 = 1 : 3) and molten KOH, HCl vapor etching method, Scanning Electron Microscope (SEM)and Transmission Electron Microscope(TEM). SEM images of same poison of GaN films with HCl vapor etching and wet etching methods gave us notably different densities and shape of etching pits, which reveal HCl vapor etching could show most kinds of Threading Dislocations (TDs), mixed acid solution (H3PO4 H2SO4 = 1: 3) is in second place and molten KOH wet etching only could show pure screw TDs.
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