MoS2-based Ferroelectric Field-Effect Transistor with Atomic Layer Deposited Hf0.5Zr0.5O2 Films Toward Memory Applications

Ming-Yang Cha,Hao Liu,Tian-Yu Wang,Lin Chen,Hao Zhu,Li Ji,Qing-Qing Sun,David Wei Zhang
DOI: https://doi.org/10.1063/5.0010829
IF: 1.697
2020-01-01
AIP Advances
Abstract:Recently, hafnium oxide (HfO2)-based ferroelectric materials have achieved phenomenal success in next-generation nonvolatile memory applications. In this study, we fabricated Hf0.5Zr0.5O2 (HZO) ferroelectric capacitors and back-gate field-effect transistors (FETs) with few-layered molybdenum disulfide (MoS2) nanosheets as the channel and a ferroelectric Hf0.5Zr0.5O2 film as the gate dielectric. Good dielectric and ferroelectric properties have been observed from the HZO film fabricated with atomic layer deposition-based techniques. The MoS2–HZO ferroelectric FETs (FeFETs) have exhibited excellent performance including ferroelectric polarization switching with a high on/off ratio and negligible degradation in endurance and retention properties. Our results shown here suggest that MoS2–HZO FeFETs can be a promising alternative for next-generation nonvolatile memories.
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