Crack Bridging in Silicon Nitride Ceramics at Various Temperatures and Grain Boundary Toughness

S Wei,LW Porz,ZP Xie,B Liu,J Chen,JM Zhao
2015-01-01
Rare Metal Materials and Engineering
Abstract:Crack bridging were investigated by elaborative observation of 5764 crack deflections and 428 bridges, generated at 77 K, 159 K, 293 K and 500 K, in silicon nitride (Si3N4) ceramics. The effect of grain boundary toughness on crack bridging behavior was investigated quantitatively using numerical simulation methods. The results show that the formation probability of bridging in silicon nitride ceramics is similar at different temperatures. When the crack deflection angle is in the range of 70 degrees similar to 90 degrees, the formation probability of bridging. is highest. Grain boundary toughness of silicon nitride ceramic bridge has obvious influence on the formation of bridging, which should not be too high or too low.
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