High-temperature Fatigue Behavior in Pre-Cracked Silicon Nitride Composites Doped with Ytterbium Oxide

WU Renbing,CHEN Jianjun,YANG Guangyi,PAN Yi,LI Junde,HUANG Zhaoduan

DOI: https://doi.org/10.3321/j.issn:1000-3851.2006.05.019

2006-01-01

Abstract:Silicon nitride materials doped with 6wt% ytterbium oxide and 2wt% alumina were prepared by nitro-gen gas pressure sintering.The high temperature dynamic fatigue behavior of the Si_3N_4 composites was investigated in terms of the loading rate dependence of fatigue strength at high temperatures.The specimens were pre-cracked by Vickers indentation to avoid creep and to ensure slow crack growth dominating in fatigue damage.The tests were performed in the four-point bending mode in air at the temperature of 1000℃,1200℃,1300℃ and 1400℃ respectively.The cross head speeds were chosen of 1,0.5,0.1 and 0.01 mm/min at each temperature.By plotting fatigue strength against cross-head speed in double logarithm coordinates,the highest slow crack exponent number N was found in the test at 1200℃,indicating that the critical crack growth was the slowest at this temperature.X-ray (diffraction) and transmission electron microscopy show that the grain boundary crystallization and crack healing(inhibit the) crack growth thus increasing the slow crack growth exponent number.Energy dispersive spectrum(reveals) that the crack surface oxidation may benefit the crystallization at 1200℃,while slow crack growth may be promoted at higher temperatures because of over-oxidation.