Abstract:The microstructure evolution and thermal stability of continuous SiC fiber-reinforced Ti60 (SiCf/Ti60) composites at elevated temperatures have not been reported. The objective of this study was to conduct thermal exposure experiments of SiCf/Ti60 composites at 400 degrees C / 100 h, 600 degrees C / 100 h, and 800 degrees C / 100 h. The aim was to compare the interfacial and matrix microstructures under hot isostatic pressure (HIP) conditions and to assess their thermal stability. The results show that SiCf/Ti60 composites have excellent long-term thermal stability at 600 degrees C thermal exposure, short-term thermal stability at 800 degrees C thermal exposure and the thickness of the reaction layer (RL) increases to 1.27 mu m. From HIP to 800 degrees C thermal exposure, RL changes from finegrained TiC II discontinuous silicides II coarse-grained TiC to fine-grained TiC II near-continuous silicides II medium-grained TiC II coarse-grained TiC. Large-sized beta-Ti and S2 silicides precipitated in the matrix at 800 degrees C thermal exposure, where beta-Ti and alpha-Ti followed the Burgers orientation relationship (BOR), and the S2 exhibited a multitude of orientation relationships with both beta-Ti and alpha-Ti. Furthermore, it was demonstrated that thermal exposure resulted in a reduction in the dislocation density of the matrix. In particular, thermal exposure at 800 degrees C led to a decrease in the dislocation density of the matrix by 47 %. This observation provided a novel approach for the reduction of crystal defects in the matrix and the enhancement of the properties of SiCf/Ti composites.

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