Abstract:Silica nanoparticles are widely utilized abrasives in chemical mechanical polishing (CMP), and the modification of abrasives and the incorporation of chemical additives represent primary strategies for enhancing CMP performance. In this study, we achieved a modification of the electrical properties of the colloidal silica surface by forming a coating film through the "grafting" of 3-aminopropyltriethoxysilane (APTES) onto the colloidal silica surface. This modification resulted in an augmented mechanical interaction between the abrasive and the wafer during the CMP process, leading to an enhanced material removal rate (MRR) of SiO 2 . However, the post-CMP surface exhibited a relatively higher occurrence of surface defects. Subsequently, cetyltrimethylammonium bromide (CTAB) was added as an auxiliary additive, which promoted the formation of a "special electrostatic self-assembly structure" on the surface of the abrasive, further elevating the SiO 2 MRR. Moreover, CTAB demonstrated the capability to adsorb onto the wafer surface, creating a protective effect that resulted in reduced surface roughness and a decrease in surface defects following CMP. Furthermore, comprehensive characterization of the modified abrasive was conducted using techniques such as transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The mechanisms underlying the improvement in CMP performance were systematically analyzed through experimental phenomena and X-ray photoelectron spectroscopy (XPS), and revealing that the introduction of CTAB indirectly facilitated the adsorption of APTES onto the surface of the colloidal silica. Our study provides a method for the advanced process of SiO 2 CMP with stringent metal ion requirements.

Preparation of Irregular Silica Nanoparticles by the Polymer Templating for Chemical Mechanical Polishing of Sapphire Substrates

Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire

A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance

Realization of atomic-level smooth surface of sapphire (0001) by chemical-mechanical planarization with nano colloidal silica abrasives

Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

Core–Shell Structured Silica Nanoparticles as Abrasive for Tungsten Chemical Mechanical Planarization

Characterization of sapphire chemical mechanical polishing performances using silica with different sizes and their removal mechanisms

Development of core–shell SiO 2 @A-TiO 2 abrasives and novel photocatalytic chemical machinal polishing for atomic surface of fused silica

Preparation of a Novel Catalyst (sofeiii) and Its Catalytic Performance Towards the Removal Rate of Sapphire Substrate During CMP Process

Study on Chemical Mechanical Polishing Performances of Sapphire Wafer (0001) Using Silica-Based Slurry

Fe-Nx/C Assisted Chemical–mechanical Polishing for Improving the Removal Rate of Sapphire

Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon Substrates

Preparation of Composite Spherical Alumina Nanoparticles and Study on their CMP Performance

Chemical mechanical polishing for sapphire wafers using a developed slurry

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Polishing behavior of PS/SiO<sub>2</sub> Core-Shell nanoparticles with different shell thickness on fused silica Chemical Mechanical Polishing

Preparation of Silane Modified Sio2 Abrasive Particles and Their Chemical Mechanical Polishing (cmp) Performances

Effects of Silica Abrasive Size on Sapphire Cmp Performances and Their Removal Mechanisms

AFM and XPS Studies on Material Removal Mechanism of Sapphire Wafer During Chemical Mechanical Polishing (CMP)

Photocatalytic assisted chemical mechanical polishing for silicon carbide using developed ceria coated diamond core-shell abrasives

Chemical mechanical polishing of sapphire wafer using mixed silica nanoparticles