Abstract:Abstract During copper CMP, abrasives and asperities interact with the copper at the nano-scale, partially removing protective films. The local Cu oxidation rate increases, then decays with time as the protective film reforms. In order to estimate the copper removal rate and other Cu-CMP output parameters with a mechanistic model, the passivation kinetics of Cu, i.e. the decay of the oxidation current with time after an abrasive/copper interaction, are needed. For the first time in studying Cu-CMP, microelectrodes were used to reduce interference from capacitive charging, IR drops and low diffusion limited currents, problems typical with traditional macroelectrodes. Electrochemical impedance spectroscopy (EIS) was used to obtain the equivalent circuit elements associated with different electrochemical phenomena (capacitive, kinetics, diffusion etc.) at different polarization potentials. These circuit elements were used to interpret potential-step chronoamperometry results in inhibiting and passivating solutions, notably to distinguish between capacitive charging and Faradaic currents. Chronoamperometry of Cu in acidic aqueous glycine solution containing the corrosion inhibitor benzotriazole (BTA) displayed a very consistent current decay behavior at all potentials, indicating that the rate of current decay was controlled by diffusion of BTA to the surface. In basic aqueous glycine solution, Cu (which undergoes passivation by a mechanism similar to that operating in weakly acidic hydrogen peroxide slurries) displayed similar chronoamperometric behavior for the first second or so at all anodic potentials. Thereafter, the current densities at active potentials settled to values around those expected from polarization curves, whereas the current densities at passive potentials continued to decline. Oxidized Cu species typically formed at ‘active’ potentials were found to cause significant current decay at active potentials and at passive potentials before more protective passive films form. This was established from galvanostatic experiments.

Effect of Cu in Electroless Ni–Cu–P Coating on Passivation Process

Electrochemical Corrosion Behavior and Surface Passivation of Bulk Nanocrystalline Copper in Alkaline Solution

Effects of Cu-content and passivation treatment on the corrosion resistance of Al0.3CuxCoCrFeNi high-entropy alloys

Corrosion resistance of Cu‐bearing 316L stainless steel tuned by various passivation potentials

Effect of Heat Treatment and Passivation on Corrosion Behavior of Electroless Ni-P Coating on 20# Steel in Simulated Soil Solution

Study on Properties of Double-Layered Ni–P–Cr Composite Coating Prepared by the Combination of Electroless Plating and Pack Cementation

Synergistic Effect of Mo, W, Mn and Cr on the Passivation Behavior of a Fe-Based Amorphous Alloy Coating

Corrosion and wear resistance behaviors of electroless Ni–Cu–P–TiN composite coating

Corrosion behavior and strengthening mechanism of Ni-Cu alloy coating on Nd-Fe-B magnets

The semi-conductor property and corrosion resistance of passive film on electroplated Ni and Cu-Ni alloys

Trivalent Chromium Passivation Process for Zinc Coating

Electrochemical behavior and electro-crystallization mechanism of Cu-Ni/Nano-Al 2 O 3 coating with a deposition current density dependence

Insights into corrosion resistance enhancement of nickel–phosphorus metallic glass in acid environment by the incorporation of copper

Effect of cupric sulfate on the microstructure and corrosion behavior of nickel-copper nanostructure coatings synthesized by pulsed electrodeposition technique

Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

Exploration of Pretreatment Process and Wettability of High Bonding Ni-P Coatings on W-Cu Composites for Electronic Packaging

Studies on Pitting Corrosion of Al-Cu-Li Alloys Part III: Passivation Kinetics of AA2098-T851 Based on the Point Defect Model

Morphology and Anti-Corrosive Performance of Cr(III) Passivated Zn-Fe Alloy Coating on NdFeB Substrate

Microstructure and Electrochemistry Behavior of Ni-Cu-P Ternary Nickel-Based Amorphous Coating

Effect of Cu on the diffusion behavior and electrical properties of Ni-Co conversion coating for metallic interconnects in solid oxide fuel cells

Systematic Insight into Chloride Concentration, Applied Potential and Time Effect on the Passive Film of Cu-Zn-Ni Ternary Alloy in Alkaline Solution