On-line Monitoring Flip LED Chip Performance Degradation and Failure Analysis

Lin Zhou,Gang Jing,Yan Liu,Haimei Luo
DOI: https://doi.org/10.1109/icept.2017.8046645
2017-01-01
Abstract:For comparing the stability and reliability of horizontal, vertical and flip LED chips, we carried on the high temperature and high current aging experiment towards to the three kinds of bare LED chips on our self-build online monitoring and accelerated life system. Most of samples shown stable performance during the entire experiment process, but there was only one flip LED chip whose illuminant, electrical and thermal performance degraded from the beginning of the test. Comparing with the normal LED flip chips, the abnormal chips' illuminant flux decreased during the whole experiment, meanwhile its forward bias and junction temperature increased as shown by the online monitoring system. We carried out anatomy and grinding towards to the abnormal chip and its reference normal one. We found that the silver refracting layer was oxidized which was main reason of the abnormal chip's performance degradation.
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