Study on LED Reliability in the Aging Process

yuan chen,dai wenwen,chen chu,yan wei
DOI: https://doi.org/10.16818/j.issn1001-5868.2011.03.011
2011-01-01
Abstract:To study the reliability of LEDs,antistatic tests and experiments on high-temperature aging were performed.The LEDs fabricated with blue-green emitting materials were divided into different groups to study the variations of the LED photo-electricity parameters in the aging process.Experimental results show that the degrading trends of the LED barechips and the packaged chips are different,and the aging degree is related with both the packaging materials and the emitting materials.For the chips without the damage of static electricity,functional failure does not appear after the aging process,and the static electricity has little effect on the parameter attenuation,which is similar with the results of single aging experiment.For the chips who can not emit normally after static hitting,rapid damages and recoveries happened in the aging experiments.
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