Abstract:By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in LEDs, the thermal, photometric, and colorimetric properties of two types of LED chip scale packages (CSPs), i.e., 4000 °K and 5000 °K samples each of which was driven by two different levels of currents (i.e., 120 mA and 350 mA, respectively), were investigated under an increasing temperature from 55 °C to 150 °C and a systemic study of driving current effect on the SSADT results were also reported in this paper. During SSADT, junction temperatures of the test samples have a positive relationship with their driving currents. However, the temperature-voltage curve, which represents the thermal resistance property of the test samples, does not show significant variance as long as the driving current is no more than the sample's rated current. But when the test sample is tested under an overdrive current, its temperature-voltage curve is observed as obviously shifted to the left when compared to that before SSADT. Similar overdrive current affected the degradation scenario is also found in the attenuation of Spectral Power Distributions (SPDs) of the test samples. As used in the reliability qualification, SSADT provides explicit scenes on color shift and correlated color temperature (CCT) depreciation of the test samples, but not on lumen maintenance depreciation. It is also proved that the varying rates of the color shift and CCT depreciation failures can be effectively accelerated with an increase of the driving current, for instance, from 120 mA to 350 mA. For these reasons, SSADT is considered as a suitable accelerated test method for qualifying these two failure modes of LED CSPs.

Accelerated Life Test for High-Power White Led Based on Spectroradiometric Measurement

The Accelerated Aging Characterization of High Power LED

A Design for &Lt;italic>in-Situ</italic> Measurement of Optical Degradation of High Power Light-Emitting Diodes under Accelerated Life Test

Accelerated Luminous Flux Depreciation Test and Reliability Assessment for LED Lighting Products

Product Level Accelerated Lifetime Test For Indoor Led Luminaires

Multi-Azimuth Failure Mechanisms in Phosphor-Coated White LEDs by Current Aging Stresses

Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method

Characteristics of the Accelerated Aging White LEDs

Life Test and Failure Mechanism Analyses for High-power LED

Thermal/luminescence Characterization and Degradation Mechanism Analysis on Phosphor-Converted White LED Chip Scale Packages

Study on the Stability of the High‐brightness White LED

Note: an Online Testing Method for Lifetime Projection of High Power Light-Emitting Diode under Accelerated Reliability Test.

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

On-Line Monitoring of Photometric, Colorimetric, Electrical and Thermal Parameters During Led Accelerated Life Testing

Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

Study Of Optical Stability For Vertical High-Power White Light-Emitting Diodes

Fault Diagnostics And Lifetime Prognostics For Phosphor-Converted White Led Packages

Uncertainty Analysis in Lifetime Measurement for White Light Emitting Diodes

Analysis of the Degradation of High Power Light Emitting Diode

Performances and microstructures of a high-power LED based on rapid thermal cycling

Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method