Abstract:Copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (Trough Silicon Via), fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grain boundaries in the films. Porous or sparse grain boundaries show very high resistivity and brittle fracture characteristic in the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on the Wiedemann-Franz’s law. Since the copper interconnections are used not only for the electrical conduction but also for the thermal conduction, it is very important to quantitatively evaluate the crystallinity of the polycrystalline thin-film materials and clarify the relationship between the crystallinity and thermal properties of the films. The crystallinity of the interconnections were quantitatively evaluated using an electron back-scatter diffraction method. It was found that the porous grain boundaries which contain a significant amount of vacancies increase the local electrical resistance in the interconnections, and thus, cause the local high Joule heating. Such porous grain boundaries can be eliminated by control the crystallinity of the seed layer material on which the electroplated copper thin film is electroplated.

CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS

Xrd Characterization of Texture and Internal Stress in Electrodeposited Copper Films on Al Substrates

Texture of Electroplated Copper Film under Biaxial Stress

Internal Stress and Yield Strength of Copper Films on Substrates

Mechanical Properties and Microstructure of Rolled and Electrodeposited Thin Copper Foil

Crystallographic Texture and Mechanical Properties by Electron Beam Freeform Fabrication of Copper/steel Gradient Composite Materials

Influence of Complexing Agents on Texture Formation of Electrodeposited Copper

Evaluation of Residual Stress in Fiber-Textured Films by X-Ray Diffraction

Research Progress on the Texture of Electrolytic Copper Foils

Microstructure and Residual Stress Gradient Evolution Mechanism of Electronic Copper Strip for Lead Frame

Application of XRD ω-scan Technique in Determining the Texture of Ni-Fe Alloy Coatings

Effects of microstructure and texture on the deep drawability of C10200 copper sheets

XRD Study on Cu Layer in IC Interconnect

The Effects of Stresses and Interfaces on Texture Transformation in Silver Thin Films

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

X-ray Diffraction Stress Analysis of Ferroelectric Thin Films with Ideal (hkl) Textures Considering the Piezoelectric Coupling Effect

Interpretation of texture changes during self-annealing of electroplated copper

Internal Stress in Cu, Ag and Ni Films on Stainless Steel and Ti Substrates

QUANTITATIVE ANALYSIS OF TEXTURE CHANGE IN THIN SILVER FILMS

Effect of a Thin Cr Layer on the Microstructures and Fracture Behaviours of Copper Films

Microstructure evolution in Cu-2.13Fe-0.026P (wt%): The contribution of texture intensity to residual stress variation