Abstract:Understanding the micromechanical behavior of polycrystalline material is pivotal for regulating its mechanical performance and widening its application. Taking advantage of its non-destructive nature, the neutron diffraction technique has been widely applied to investigate the micromechanical behaviors, usually at the resolution of grains sharing the same diffraction plane. This work employs a newly developed technic of the texture-component-dependent (TCD) in-situ neutron diffraction method to obtain the full strain/stress tensor of a textured CuZnPb alloy at the resolution of individual crystallographic orientation. The variation of the internal stresses and lattice strains over the grains that share the same diffraction plane has been successfully captured by the TCD method. According to the results of in situ neutron diffraction, Copper ({-1-1-2} ) possesses the highest lattice stress while Cube ({010} ) and Goss ({110} ) bear the lowest stress of 370 MPa. In parallel, the micromechanical response of the texture components is modeled by the elastic visco-plastic self-consistent (EVPSC) model. The simulated results are in reasonable agreement with the corresponding experiments in loading direction, while the lateral stress exhibits some deviation. By crystal plasticity finite element modeling, the deviation is related to the neighbor grain which affect more significantly the lateral stress than the material parameters. The full tensor of stress within the individual crystallographic orientation measured by TCD method gives more insight into the crystal plasticity modeling.

Texture of Electroplated Copper Film under Biaxial Stress

Xrd Characterization of Texture and Internal Stress in Electrodeposited Copper Films on Al Substrates

CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS

Evaluation of Multiaxial Stress in Textured Cubic Films by X-Ray Diffraction

Evaluation of Residual Stress in Fiber-Textured Films by X-Ray Diffraction

X-ray Diffraction Stress Analysis of Ferroelectric Thin Films with Ideal (hkl) Textures Considering the Piezoelectric Coupling Effect

Crystallographic Texture and Mechanical Properties by Electron Beam Freeform Fabrication of Copper/steel Gradient Composite Materials

Relationship between the Orientation of the (100) Crystal Plane and Elongation in Ultrathin Electrolytic Copper Foils

A Study on the Microstrains in the Textured YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-d</sub> Superconductor Films

Residual Stress of Pb(ZrxTi1−x)O3 Films with Mixed Textures

Internal Stress and Yield Strength of Copper Films on Substrates

Measuring texture-component-dependent stress of CuZn39Pb2 by neutron diffraction

Microstructure and Residual Stress Gradient Evolution Mechanism of Electronic Copper Strip for Lead Frame

Dependence of Stresses and Strain Energies on Grain Orientations in Fcc Metal Films

Dependence of Stresses on Grain Orientations in Thin Polycrystalline Films on Substrates: an Explanation of the Relationship Between Preferred Orientations and Stresses

Evolution Rule of Aluminum Alloy Textures under Plane Stress State

Dependence of the Stresses on Grain Orientations in Hexagonal Films

The Effects of Stresses and Interfaces on Texture Transformation in Silver Thin Films

Influence of Complexing Agents on Texture Formation of Electrodeposited Copper

Cyclic Stress-Strain Response Of A Copper Tricrystal And Bicrystal

X-Ray Residual Stress Measurement in Films with Crystallographic Texture and Grain Shape