Abstract:Under mechanical loading, the strain hardening behavior of crystalline face-centered cubic (FCC) metals is of critical importance in determining fracture behavior and overall mechanical performance. While strain hardening is typically accompanied by a decrease in ductility, it can also simultaneously enhance the material's resistance to plastic deformation and improve its load bearing capacity. Hence, we conducted a detailed study using copper (Cu) single-crystal micropillars as a model system to investigate and delineate the relationship between strain hardening and defect behavior. We employed in situ compression in a scanning electron microscope (SEM) and dislocation density-based crystal plasticity (DCP) modeling. The strain hardening rate varied with the compression crystallographic orientation, ranging from negligible values (of approximately 80 MPa) to relatively high hardening rates (of approximately 1150 MPa) for nominal strains of up to 15%. Various analysis methods were applied, including slip trace characterization, electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), and transmission Kikuchi diffraction (TKD). These techniques allowed us to identify the distributions of active slip systems, dislocation structures after compression, and correlated internal lattice rotations. Furthermore, the DCP model was developed to specifically understand how serration events are related to dislocation-density evolution or strain bursts, and this was validated with the micropillar experiments. This integrated experimental and modeling investigation offers valuable insights and predictions regarding the evolution of both total and partial dislocations, including Hirth and Lomer junctions, as well as lattice rotations.

Cyclic Stress-Strain Response Of A Copper Tricrystal And Bicrystal

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

The Influence of Crystal Defects on the Elastic Properties of Tungsten Metals

Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary

A Multiscale Investigation of the Physical Origins of Tension--Compression Asymmetry in Crystals and their Implications for Cyclic Behavior

MESOMECHANICAL ANALYSIS OF THE TENSILE DEFORMATION OF PURE COPPER BICRYSTAL

On twinning and shear banding in copper single crystals with rolling texture orientations plane strain compressed at high strain rate

Study of the Thermomechanical Behavior of Single-Crystal and Polycrystal Copper

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An investigation of the combined size and rate effects on the mechanical responses of FCC metals

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Crack bifurcation behavior of coarse-grained copper under cyclic torsion combined with axial static loading

Intersectant Coherent Twin Boundaries Governed Strong Strain Hardening Behavior in Nanocrystalline Cu

Shock Response of Copper Bicrystals with a ∑3 Asymmetric Tilt Grain Boundary

Dependence of hardening and saturation stress in persistent slip bands on strain amplitude during cyclic fatigue loading

Identification of active slip modes in twinned bicrystals of GNS/Cu composite through intragranular misorientation axes analysis

A fundamental understanding of how dislocation densities affect strain hardening behavior in copper single crystalline micropillars

Molecular dynamics simulation on mechanisms of plastic anisotropy in nanotwinned polycrystalline copper with {111} texture during tensile deformation

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Atypical Three-Stage-hardening Mechanical Behavior of Cu Single-Crystal Micropillars

The Interface And Surface Effects Of The Bicrystal Nanowires On Their Mechanical Behaviors Under Uniaxial Stretching