Study on the Structure of SiC/PI Composite Film and Its Performance in Carbonization Process

寇玉洁,张盼盼,牛永安,刘俊凯,白瑞,李垚
DOI: https://doi.org/10.16490/j.cnki.issn.1001-3660.2014.02.009
2014-01-01
Surface Technology
Abstract:Objective To broaden the application area of silicon carbide reinforced polyimide( SiC /PI) composite film as erosion resistant coating. Methods The stretch film forming method was used to prepare SiC / PI composite films,then SiC / PI film was carbonized at temperatures ranging from 600 to 1000 ℃,and the carbon films were analyzed by SEM,XRD and FTIR tests for the change of the organizational structure after carbonization. Results Due to its role as a physical junction,silicon carbide nano-particles increased the heat stability and carbon yield of the films,and granted the films with plastic fracture characteristics. As the temperature increased,the Hexagonal carbon layer structure was gradually formed. Silicon carbide and polyimide aromatic nuclear free radical polymerized and produced molecules with more rings in carbonization,and Si—O bonds were formed on the interface of SiC and PI. Conclusion During the carbonization,the nano-particles SiC and PI interacted to form weak bond,improving the interface bonding and the heat resistance of carbon films.
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