Preparation and properties of nano-SiC/polyimide composite films with low thermal expansion characteristic

Lü Jing,DANG Zhimin

2011-01-01

Abstract:Nano-SiC/Polyimide(n-SiC/PI) composite films were prepared by using in-situ dispersive polymerization.The surface morphology,thermal expansion,dielectric properties and thermal stability of n-SiC/PI were studied by SEM,thermal mechanical analysis(TMA),impedance analyzer and thermal gravimetric analysis(TG) respectively.The results show that n-SiC particles are dispersed in the PI matrix evenly by employing the in-situ polymerization.The coefficient of thermal expansion(CTE) of n-SiC/PI composite films decreases with the increasing of the SiC content,while the experimental data could be analyzed by Kerner model closely.The CTE of PI with n-SiC mass fraction of 15% decrease about 11% than that of the pure PI.The dielectric constant and dielectric loss of films vary with the content of n-SiC fillers,remaining in the lower range and stable in a wide frequency range.