Effect of Tensile Stress on Microstructure Evolution of Al-Cu-Mg-Ag Alloys

Zhou Jie,Liu Zhi-yi,Li Yun-tao,Liu Yan-bin,Xia Qing-kun,Duan Shui-liang
IF: 3.752
2007-01-01
Transactions of Nonferrous Metals Society of China
Abstract:The effect of tensile stress on thermal microstructure evolution of Ω phase in an Al-Cu-Mg-Ag alloy with high Cu/Mg ratio and higher Ag content was investigated by transmission electron microcopy(TEM) .The samples were aged at 200 ℃ for 1 h(T6 condition),then thermal exposed at 250 ℃ for 100 h with and without a tensile stress(130 MPa),respectively. The results indicate that Ω precipitates uniformly disperse in the matrix as a major precipitate after artificially aging at 200 ℃ for 1 h(T6 condition). Exposed at 250 ℃ for 100 h without stress,Ω precipitates dissolve dramatically. Whereas,during stress exposure they coarsen unexpectedly rather than dissolve into matrix. It can be deduced that the stress retards the redissolution of Ω phase.
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