Tungsten Plug Missing Defects Monitoring Method and Its Solution by Optimization of Polymer Cleaning and Micro-environment

Rongwei Fan,Hunglin Chen,Kai Wang,Yin Long,Qiliang Ni
DOI: https://doi.org/10.1109/iitc.2018.8430444
2018-01-01
Abstract:This paper describes the tungsten (W) missing defects monitoring method with electron-beam inspection systems, and its solution by optimization of polymer cleaning and micro-environment. W missing defects detection and monitoring method was developed and fixed on bare silicon wafer. Then a series of experiments was carried out, and W missing defects were fixed by the optimization of polymer cleaning and micro-environment of the front side open unit port (FOUP).
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