The total inspection solutions of extreme tiny defect in BEOL advanced semiconductor process

Xingdi Zhang,Hunglin Chen,Yin Long,Qiliang Ni,Rongwei Fan,Kai Wang
DOI: https://doi.org/10.1109/cstic.2018.8369268
2018-01-01
Abstract:In this paper, extreme tiny defects are detected and monitored by using brightfiled inspection system in 28nm back-end-of-the-line (BEOL) processes. Two main defects, including tiny bridge and tiny bump defects, were studied by a novel combination of dedicated scan settings such as spectrum mode, directional electrical field (DEF), focus offset and so on. The purpose of these studies is to capture defects more efficiently. After defect detecting, failure models of these defects were established and the effective defect reduction actions were carried out. Combining effective defect monitor and defect reduction actions can make BEOL yield improve rapidly.
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