Abstract:The vapor-box is a liquid metal based design to cope with the demanding conditions of the divertor. This design relies on the recirculation of lithium by evaporation and condensation. An issue to this approach is the safety risks of Li-D/T formation and co-deposition on both the vapor-box walls - leading to possible recirculation impedance- and on the first wall leading to unacceptable tritium retention. Additively manufactured tungsten Capillary Porous Structure (CPS) samples filled with Li were exposed to high heat flux D plasmas in the linear plasma device Magnum-PSI and Li-D co-deposition was measured as a function of substrate temperature, estimated to be in the range 200-428 C and distance between 25-85 mm to the plasma beam center. The D:Li ratio was determined via in-situ ion beam diagnostics (NRA and EBS) and the spectra analyzed simultaneously to maximise the precision of the measurement. The experimental results approach close to the theoretical maximum at 40:60 D:Li ratio and the thickness of the deposited films was 0.02 - 3.2 m. For witness plate temperatures above 400 C Li films under 150 nm in thickness were deposited and show lower D:Li ratios, as low as 5:95 D:Li ratio. At these temperatures the evaporation rate from the WPs is close to the deposition rate, and the decomposition pressure for LiD becomes comparable to the operational pressure in the vessel during the discharge. SOLPS-ITER simulations were also conducted to complement the experimental data. The results were used to narrow the range of CPS surface temperature to between ^{\circ} ^{+} ^{+} \%$, which matches well with the value determined from a quartz crystal microbalance. Due to limitations in the modeling of neutral interactions with Li coated surfaces, the SOLPS-ITER modeling does not well recreate the observed Li and D deposition layers on the WPs, indicating that this aspect of the modeling in Eirene needs improvement to accurately model plasmas containing significant quantities of Li. However, SOLPS-ITER simulations should be extended to include LiD molecules and improve the accuracy of heat flux towards the target to improve the comparison with experimental data.

Deuterium Trapping in the Carbon-Silicon Co-Deposition Layers Prepared by RF Sputtering in D 2 Atmosphere

Deuterium Retention in SiC Coated Graphite by D2+ Implantation

Trapping behaviour of deuterium ions implanted into tungsten simultaneously with carbon ions

Deuterium retention in silicon carbide, SiC ceramic matrix composites, and SiC coated graphite

Surface Diversifying and Deuterium Retention Characteristics of Doped Graphite with SiC Coating Exposed to Plasma Discharges in EAST Tokamak

Deuterium Retention in Tungsten Films Deposited by Magnetron Sputtering

Deuterium reclamation from C-Si codeposits using thermo-oxidation

Deuterium retention in tungsten co-deposits with neon and argon inclusions

Deuterium Retention in Tungsten-Doped Amorphous Carbon Films Exposed to Deuterium Plasma

Cold Deposition of Large-Area Amorphous Hydrogenated Silicon Films by Dielectric Barrier Discharge Chemical Vapor Deposition

Hydrogen Trapping under the Effect of W–C Mixed Layers

Carbon - Silicon Heterojunction Diodes Formed by CH4/ Ar Rf Plasma Thin Film Deposition on Si Substrates

The Effect of Relatively Low Hydrogen Dilution on the Properties of Carbon-Rich Hydrogenated Amorphous Silicon Carbide Films

Deuterium Irradiation Resistance and Relevant Mechanism in W–ZrC/Sc2O3 Composites Prepared by Spark Plasma Sintering

Deuterium Retention in Sic-Coated Graphite Tiles of East

Thermal desorption study of deuterium on Si(100) surface

Deuterium retention in co-deposition with lithium in Magnum-PSI: experimental analysis and comparison with SOLPS-ITER

Experimental Measurement of Deuterium Concentration and Depth Profiling in Tungsten by Radio Frequency Glow Discharge Optical Emission Spectroscopy

Temperature Dependence of Retention of Energetic Deuterium and Carbon Simultaneously Implanted into Tungsten

Deposition of Dense SiO2 Thin Films for Electrical Insulation Applications by Microwave ECR Plasma Source Enhanced RF Reactive Magnetron Sputtering

Dynamics Of Hydrogen Isotope Trapping And Detrapping For Tungsten Under Simultaneous Triple Ion (C+, D-2(+) And He+) Implantation