Abstract:Wet chemical etching of polycrystalline metals produces non‐uniform etch profiles, which poses a major challenge in nanofabrication of metal interconnects in future microelectronics components. A new approach that combines multiple cycles of cryo‐oxidation of the surface of nanoscale metal followed by selective oxide dissolution overcomes this challenge and produces desired smooth and uniform nanostructures. With the persistent downscaling of integrated circuits, molybdenum (Mo) is currently considered a potential replacement for copper (Cu) as a material for metal interconnects. However, fabricating metal nanostructures with critical dimensions of the order of 10 nm and below is challenging. This is because the very high density of grain boundaries (GBs) results in highly non‐uniform surface profiles during direct wet etching. Moreover, wet etching of Mo with conventional aqueous solutions is problematic, as products of Mo oxidation have different solubility in water, which leads to increased surface roughness. Here, a process is shown for achieving a stable and uniform soluble surface layer of Mo oxide by wet oxidation with H2O2 dissolved in IPA at −20 °C. The oxide layer is then selectively dissolved, and by repeating the oxidation and dissolution multiple times, a uniform etch profile is demonstrated with a fine control over the metal recess. Ultimately, this presents a method of precise and uniform wet etching for Mo and other metals needed to fabricate complex nanostructures that are critical in developing next‐generation electronic devices.

Controllable nano-texturing of diamond wire sawing polysilicon wafers through low-cost copper catalyzed chemical etching

Cu-assisted Chemical Etching of Diamond Wire Sawn Multicrystalline Silicon Wafers for Texturing

Nano-Texturing of Silicon Wafers Via One-Step Copper-Assisted Chemical Etching

A Metal-Free Additive Texturization Method Used for Diamond-Wire-sawn Multi-Crystalline Silicon Wafers

Constructing Submicron Textures on Mc-Si Solar Cells Via Copper-Catalyzed Chemical Etching

Nano-Texturing of Single Crystalline Silicon Via Cu-Catalyzed Chemical Etching

Surface Texturing Behavior of Nano-Copper Particles under Copper-Assisted Chemical Etching with Various Copper Salts System

High-Efficient Solar Cells Textured by Cu/Ag-Cocatalyzed Chemical Etching on Diamond Wire Sawing Multicrystalline Silicon

Effect of Additives on Making Texture Surface on Multicrystalline Silicon Wafer by Diamond Wire Sawing

Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching

Copper Assisted Inverted Pyramids Texturization of Monocrystalline Silicon in a Nitrogen Bubbling Bath for Highly Efficient Light Trapping

Silicon Surface Texturing Via Tbab-Sds Composite Additives Enhanced Copper-Assisted Chemical Etching

Surface damage and metal-catalyzed chemical etching investigation of multicrystalline silicon by diamond wire sawing

Simple Approach to Wafer-Scale Self-Cleaning Antireflective Silicon Surfaces.

High-precision and high-speed etching of diamond surfaces using Fe–Ni alloy catalyzed H–O plasma etching

A high efficiency industrial polysilicon solar cell with a honeycomb-like surface fabricated by wet etching using a photoresist mask

Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires

Wet chemical etching of silicon for conically textured surfaces

Catalytic Etching Of {100}-Oriented Diamond Coating With Ni And Cu Nanoparticles Under Hydrogen

Versatile Strategies for Improving the Performance of Diamond Wire Sawn Mc-Si Solar Cells

Progress and Mechanism of Cu Assisted Chemical Etching of Silicon in A Low Cu2+ Concentration Region