Abstract:<p>Crystalline silicon tandem devices with perovskites, CIGS, and nanocrystalline silicon, as well as the TOPCon design, are incompatible with the conventional pyramidal surface texture of silicon. This is a result of crack formation in nano to polycrystalline growth on large sharp surface features. In this work, three texturing approaches are investigated, using alkaline and/or acidic wet chemical etches, that can lead to the crack‐free growth of nano to polycrystalline materials on textured surfaces. In this work, we show that without acidic smoothening, the fraction of <111> pyramidal surface coverage has to remain relatively small to prevent crack formation during crystalline growth on these surfaces. Applying an acidic etch as a function of time continuously smoothens surface features. This shifts the reflection to wider scattering angles and results in higher total reflected intensity with respect to the conventional texture, making it an interesting option for a wide variety of tandem pv applications. Finally, we demonstrate crater‐like features on a <100> monocrystalline silicon surface using an etching process including a sacrificial layer. These craters increase light scattering into wider angles, but to a lesser extent than the former approach. In terms of passivation, we demonstrate the positive effect of a post deposition hydrogen treatment. Initial dilution of the silane plasma improves passivation on a <111> surface, but is detrimental to passivation on a <100> surface, likely because the hydrogen dilution results in epitaxial growth at the c‐Si/a‐Si:H hetero‐interface. A minority carrier lifetime of over 3 ms has been achieved for all texturing approaches, after deposition of a 15 nm a‐Si:H layer on both sides of the wafer, for different a‐Si:H deposition and annealing schemes.</p>

Copper Assisted Inverted Pyramids Texturization of Monocrystalline Silicon in a Nitrogen Bubbling Bath for Highly Efficient Light Trapping

Constructing Submicron Textures on Mc-Si Solar Cells Via Copper-Catalyzed Chemical Etching

A Metal-Free Additive Texturization Method Used for Diamond-Wire-sawn Multi-Crystalline Silicon Wafers

One-step Cu-assisted chemical etching at room temperature of inverted pyramid array for high-performance crystalline silicon solar cells

Surface Texturing of Silicon Wafers by Two-step Ag-assisted Etching Process with New NSR Solution

Controlled fabrication of upright and inverted pyramid arrays of silicon via the interaction of copper ions and oxidants in hydrofluoric acid

TEXTURIZATION OF MONOCRYSTALLINE SILICON FOR SOLAR CELLS

Improvement of conversion efficiency of multicrystalline silicon solar cells by incorporating reactive ion etching texturing

Metal-catalyzed chemical etching using DIO3 as a hole injection agent for efficient submicron-textured multicrystalline silicon solar cells

Rapid and low temperature micro inverted pyramid texturing of silicon via copper catalyzed chemical etching for high efficiency PEDOT:PSS/silicon hybrid solar cells

Study and analysis the Cu nanoparticle assisted texturization forming low reflective silicon surface for solar cell application

An Innovative Light Trapping Structure Fabrication Method on Diamond-Wire-Sawing Multi-Crystalline Silicon Wafers

Advanced textured monocrystalline silicon substrates with high optical scattering yields and low electrical recombination losses for supporting crack‐free nano‐ to poly‐crystalline film growth

Research on Silicon Wafer Surface Phase under the Ultra-thin Slicing Process and Its Etching Hindrance Behavior during Metal-Assisted Chemical Etching

Ultrafast Random‐Pyramid Texturing for Efficient Monocrystalline Silicon Solar Cells

Copper-Induced Crystallization of Sputtered Silicon on Zno:Al Substrate and the Textured Interface for Light Trapping

Hydrogen Bubbles and Formation of Nanoporous Silicon During Electrochemical Etching

Diverse Texturing Characteristics Through Metal-Assisted Plasma Etching with Silver Nanowires

Effect of Surface Texture on Pinhole Formation in SiO x-Based Passivated Contacts for High-Performance Silicon Solar Cells

Wet chemical etching of silicon for conically textured surfaces

CMOS-Compatible Electrochemical Nanoimprint:High Throughput Fabrication of Ordered Microstructures on Semiconductor Wafer by Using a Glassy Carbon Mold