An Al$_{0.25}$Ga$_{0.75}$N/GaN Lateral Field Emission Device with a Nano Void Channel

De-Sheng Zhao,Ran Liu,Kai Fu,Guo-Hao Yu,Yong Cai,Hong-Juan Huang,Yi-Qun Wang,Run-Guang Sun,Bao-Shun Zhang
DOI: https://doi.org/10.1088/0256-307x/35/3/038103
2018-01-01
Chinese Physics Letters
Abstract:We report an Al0.25Ga0.75N/GaN based lateral field emission device with a nanometer scale void channel. A similar to 45 nm void channel is obtained by etching out the SiO2 sacrificial dielectric layer between the semiconductor emitter and the metal collector. Under an atmospheric environment instead of vacuum conditions, the GaN-based field emission device shows a low turn-on voltage of 2.3 V, a high emission current of similar to 40 mu A (line current density 2.3 mA/cm) at a collector bias V-C = 3 V, and a low reverse leakage of 3 nA at V-C = -3 V. These characteristics are attributed to the nanometer scale void channel as well as the high density of two-dimensional electron gas in the AlGaN/GaN heterojunction. This type of device may have potential applications in high frequency microelectronics or nanoelectronics.
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