High-speed power MOSFET with low reverse transfer capacitance using a trench/planar gate architecture

Jin Wei,Yuru Wang,Meng Zhang,Huaping Jiang,Kevin J. Chen
DOI: https://doi.org/10.23919/ISPSD.2017.7988956
2017-01-01
Abstract:A trench/planar MOSFET (TP-MOS) is proposed in this work as a high speed switching device. The device is comprehensively studied with numerical simulations, and comparisons are made with the conventional MOSFET (C-MOS) and the split-gate MOSFET (SG-MOS). Compared to the C-MOS, the removal of the MOS-structure above the JFET region results in a dramatic reduction of the reverse transfer capacitance (C <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rss</inf> ) in the SG-MOS and TP-MOS. The top p-base in the TP-MOS expedites the depletion in the JFET region, which helps further reduce the C <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rss</inf> and alleviates the electric field crowding. The additional trench channels in the TP-MOS lowers the total channel resistance, which compensates the increase of JFET resistance caused by the absence of the electron accumulation layer under the MOS-structure. Therefore, the TP-MOS achieves the best R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> -C <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rss</inf> trade-off.
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