A Novel Planar InAs/Si Hetero-TFET with Buried Drain Design and Face-tunneling Technique

Bin Lu,Hongliang Lu,Yuming Zhang,Yimen Zhang,Zhijun Lv,Yingxiang Zhao
DOI: https://doi.org/10.1109/icsict.2018.8564867
2018-01-01
Abstract:In this paper, a novel planar InAs/Si heterojunction tunnel field-effect transistor (HTFET) is proposed and studied by numerical simulations. Utilizing the large conduction band offset between InAs and Si, the buried drain design with selective doping in the Si substrate instead of the top InAs layer is applied to suppress the Shockley-Read-Hall (SRH) recombination significantly, achieving the off-state current (I OFF ) about two decades lower than the conventional InAs-doped drain. Besides, the face-tunneling technique is also incorporated to place the gate parallel with the InAs/Si tunneling interface. Thus all the points on the tunneling interface are the same distance far away from the gate electrode and the tunneling field is uniformly distributed along the tunneling interface resulting in almost simultaneous carrier tunneling process and very sharp turn on/off switch. In addition, different with most of the HTFET designs, the proposed InAs/Si HTFET with planar device architecture is more preferable for the compatibility with the standard CMOS processes, exhibiting its promising potential for future ultra-low power applications.
What problem does this paper attempt to address?